The AMP TE Connectivity Vertical Header with 0.100in pitch ensures mass wiring termination. Featuring IDC technology, it reduces labor costs and is ideal for...
The AMP TE Connectivity MTA-100 series Vertical Header is a versatile wire-to-board and wire-to-wire connector system using Insulation Displacement Contact (IDC) technology. It enables mass termination of wires, significantly reducing labor costs while ensuring reliable connections.
With a pitch of 0.100 inch (2.54mm), the connector optimizes space efficiency with its single-row design. It features wire feed-through capability, supporting daisy-chain applications.
Key Features • Color-coded housings for easy identification of wire gauge • Multiple plating options (Tin, 15μ Gold, and 30μ Gold for enhanced conductivity • Audible latch on wire-to-wire housings for secure mating • High current rating (5A) and voltage rating (250V) • Available in through-hole and surface mount configurations
Applications • Industrial electronics • Wire-to-board connections • Harness assemblies • Daisy-chain systems
Known for its rugged construction, the MTA-100 series provides dependable electrical connections in demanding environments.
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