AMP - TE CONNECTIVITY Vertical Header
The AMP TE Connectivity Vertical Header with 0.100in pitch ensures mass wiring termination. Featuring IDC technology, it reduces labor costs and is ideal for...
The AMP TE Connectivity MTA-100 series Vertical Header is a versatile wire-to-board and wire-to-wire connector system using Insulation Displacement Contact (IDC) technology. It enables mass termination of wires, significantly reducing labor costs while ensuring reliable connections.
With a pitch of 0.100 inch (2.54mm), the connector optimizes space efficiency with its single-row design. It features wire feed-through capability, supporting daisy-chain applications.
Key Features
- Color-coded housings for easy identification of wire gauge
- Multiple plating options (Tin, 15μ Gold, and 30μ Gold for enhanced conductivity
- Audible latch on wire-to-wire housings for secure mating
- High current rating (5A) and voltage rating (250V)
- Available in through-hole and surface mount configurations
Applications
- Industrial electronics
- Wire-to-board connections
- Harness assemblies
- Daisy-chain systems
Known for its rugged construction, the MTA-100 series provides dependable electrical connections in demanding environments.
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- 0-2个工作日内发货
- 配送至 美国：3-5 个工作日*
- 免费配送
- Industrial Control Systems
- Automotive Wiring Harnesses
- Consumer Electronics
- Computer Peripheral Devices
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- Pitch: 0.100 inch (2.54mm)
- Contact Configuration: Single Row
- Termination Type: IDC (Insulation Displacement Contact)
- Wire Sizes Supported: 28 to 22 AWG
- Current Rating: 5A
- Voltage Rating: 250V
- Plating Options: Tin, 15μ Gold, 30μ Gold
- Mounting Configurations: Through-hole and Surface mount
- Housing Material: Thermoplastic
- Weight: 20g
Always follow local regulations and product guidance.
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