Proto Advantage TSSOP38 to DIP38 Adaptor, 0.5mm Pitch
The Proto Advantage TSSOP38 to DIP38 Adaptor converts surface mount TSSOP38 packages to dual inline pin (DIP) format. Ideal for prototyping, testing and development...
The Proto Advantage TSSOP38 to DIP38 Adaptor provides a reliable solution for converting surface mount TSSOP38 packages to dual inline pin (DIP) format. Ideal for prototyping and testing applications, this adaptor features a 1.5mm thick FR4 epoxy fibreglass construction with double-sided 35µm copper layers for optimal conductivity and durability.
Both sides are chemically plated with Ni/Au surface and protected with solder stop masks, ensuring excellent solderability and long-term reliability. The board is designed with through-hole adaptors, making it compatible with standard breadboards and prototyping systems.
Key Features:
- Top side accommodates surface mount connector footprints
- Bottom side includes pads for two single row surface mount vertical headers
- 1.0mm hole diameter for easy integration
- Includes PCB, surface mount pin headers, and 2x assembly spacers
Dimensions & Specifications:
- External Height: 50.08mm
- External Width: 25.4mm
- Board Thickness: 1.6mm
This adaptor is particularly useful for electronics engineers and hobbyists who require a stable platform for testing and development, ensuring seamless transitions between TSSOP38 chips and DIP-based circuit designs.
- Thickness: 1.5mm
- FR4 Epoxy Fibreglass
- Double-sided 35µm copper layers
- Chemical Plating: Ni/Au
- Solder Stop Masks
- Width: 25.4mm
- Height: 50.08mm
- Board Thickness: 1.6mm
- Hole Diameter: 1.0mm
- Includes: PCB, surface mount pin headers, and 2x assembly spacers
Always follow local regulations and product guidance. Use appropriate PPE.
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