WARTON Microprint P2010 Lead-Free Solder Paste, 40g Syringe
Shop WARTON Microprint P2010 Lead-Free Solder Paste in a 40g syringe. Halogen-free, no-clean formulation with no slump. Ideal for SMT and precision soldering.
WARTON Microprint P2010 Lead-Free Solder Paste is a high-performance, no-clean solder paste designed for air and nitrogen reflow processes. Developed for use with SAC alloys, it performs exceptionally well at higher processing temperatures. This solder paste is compatible with various substrate materials, including Sn/Pb, Au/Ni, and OSP-treated finishes, making it versatile for different soldering applications.
Key Features
- Halogen-free for improved reliability
- Slump-free with no solder balling, ensuring clean, precise soldering
- Suitable for both air and nitrogen reflow environments
- Leaves a clear, probe-testable residue for easy inspection
- Offers excellent soldering performance with a 72-hour tack life
- 12-month refrigerated shelf life when stored below 10°C
- Fast printing with speeds of 20-100mm/sec
- No-clean formulation meets ROM0 (J-STD-004) standards
With a melting temperature of 220°C, this solder paste ensures reliable joints for a variety of electronic assemblies. Its 40g syringe packaging makes it convenient for precise dispensing.
- Electronic assembly
- PCB soldering components
- SMT (Surface Mount Technology) applications
- Board prototyping and production
- Metting temperature: 220°C
- Tack life: 72 hours
- Shelf life: 12 months refrigerated (below 10°C)
- Packaging: Syringe (40g)
- Speed: 20-100mm/sec
- Halogen-free: Yes
- Solderting method: Reflow (air/N2)
- Slump-free: Yes
- Solder balling: No
- Compatibility: Sn/Pb, Au/Ni, OSP-treated
- Uses: Roaming
- Standards: Meets J-STD-004 ROM0 standards
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