Showing 10111-10140 of 116084 items
Mikroelektronika
Expand your Arduino Uno with the MIKROELEKTRONIKA Click Shield. Features two mikroBUS sockets for 75+ click boards. Supports 3.3V & 5V.
NXP
NXP 74HC574 high-speed octal D flip-flop with tri-state outputs. 14ns delay, 123MHz, for communications & networking. SOIC-20 package.
Seeed Studio
SEEED STUDIO BeagleBone Green dev board with 2x Grove ports. ARM Cortex-A8, 512MB RAM, 4GB storage. Ideal for IoT and prototyping.
Amec Thermasol
AMEC THERMASOL micro-porous ceramic heatsink (10x10x2mm). Non-conductive, low-profile cooling with pre-applied thermal tape.
FTDI
FTDI evaluation board for bridging a 32-bit FIFO bus to USB 3.0. Supports SuperSpeed, multiple I/O voltages & FMC/HSMC FPGA connectors.
Microchip
Microchip TC7662A DC-DC converter IC. Converts +3-18V to -3-18V, 40mA output, no inductors needed. 8-pin DIP package for through-hole mounting.
NXP absolute pressure sensor for altimeter & barometer applications. 6-pin SIP, 15-115kPa range, analogue output. Ideal for microcontrollers.
St MicroElectronics
STM 3.3V LDO voltage regulator in SOT-223 package. 800mA output, low dropout, high PSRR. Ideal for stable power in electronics.
Harwin
Harwin 32-way DIL IC socket with gold-plated beryllium copper contacts. Low-profile, auto-insertable design. Sold in a 12-pack.
CamdenBoss
CamdenBoss 240V AC green neon indicator with chrome bezel & polycarbonate body. Ideal for electrical panels & industrial control.
T Global
T GLOBAL 1.5mm carbon gap filler sheet for electronics. Provides 3.2W/m.K thermal conductivity, electrical insulation & shock absorption.
Bergquist
BERGQUIST Sil-Pad 400 thermally conductive sheet (300x300mm). Provides 0.9W/m.K thermal conductivity and 3.5kV electrical isolation.
Fischer
Professional two-part epoxy adhesive. Thermally conductive (0.836 W/m·K) & electrically insulating. Replaces mechanical fastenings.
Boyd
BOYD PF436G aluminium heatsink for TO-220 devices. 25°C/W thermal resistance, horizontal mount, black anodised finish.
BOYD aluminium heatsink for TO-220/218/247 packages. Thermal resistance 8.6°C/W, with solderable tabs. Ideal for power electronics cooling.
Wakefield Thermal
Vertical aluminium heatsink for TO-220 packages. 3.8°C/W thermal resistance, black anodised finish, 33mm x 43mm.
Diodes Inc.
DIODES INC. ZTX451 NPN silicon bipolar transistor. 1A, 60V, E-Line package. For power management and industrial circuits.
80V, 18A protected Power MOSFET with thermal shutdown & diagnostic feedback. TO-263 package for automotive & industrial use.
VISHAY
VISHAY IRF840APBF power MOSFET: 500V, 8A, 0.85Ω, in TO-220AB package. Designed for industrial power management & conversion.
Infineon
Infineon N-Channel CoolMOS Power MOSFET, 800V, 11A, 0.39 ohm, TO-220FP through hole mounting for high efficiency power conversion.
STMicroelectronics STP12NM50 N-channel MOSFET: 550V, 12A, 0.35 ohm, TO-220, through-hole. Designed for high efficiency and reliability.
Onsemi
High-performance ONSEMI P-Channel MOSFET (40V, 14A, 0.044Ω) in DPAK package for efficient power switching and motor control.
AEC-Q101 qualified VISHAY BYW56 diode. 1kV, 2A, with avalanche protection for industrial & automotive surge and rectification circuits.
Broadcom
Broadcom 2-digit red 7 segment LED display (14.2mm). Features common anode, ±50° viewing angle & high contrast. Ideal for indoor use.
Higgstec
Durable 15-inch 5-wire resistive touch panel by HIGGSTEC. Ideal for metering, test measurement and automation. Stable, accurate & long lifecycle.
BROADCOM SFH756V IR emitter with 660nm wavelength, 10Mbaud data rate, and TosLink connector for polymer optical fibre.
BOYD undrilled aluminium heatsink, 50 x 29.5 x 11mm, black anodised finish. Suitable for TO-218 & TO-220 devices.
High-reliability 6.8V Zener diode in SOT-23 package. 350mW, lead-free, AEC-Q101 qualified for automation & automotive use.
NXP octal non-inverting buffer and line driver with 3-state outputs in a SOIC-20 package. Ideal for industrial and automotive use.
Wiley
Beginner's guide to Arduino with step-by-step projects. Learn electronics, programming, and build robots, automations & more.
