CHIP QUIK Lead-Free Low Temp Solder Paste, Sn42/Bi57.6/Ag0.4, 50g
Low temperature solder paste for delicate electronics. No-clean flux formulation ensures reliable soldering without residue worries. 50g jar.
The CHIP QUIK Lead-Free Low Temperature Solder Paste provides a reliable and efficient soldering solution for delicate components, thanks to its low melting point of 138°C. This no-clean, thermally stable solder paste comes in a convenient 50g jar, making it ideal for professional and hobbyist applications alike.
Key advantages include reduced thermal damage to sensitive components, ensuring the longevity and reliability of your electronic assemblies. With printing speeds up to 125mm/sec and a long stencil life, this solder paste enhances productivity while maintaining high-quality results.
Features: * Low melting temperature (138°C) for reduced heat exposure * No-clean synthetic flux leaves clear residue * Excellent wetting compatibility with most board finishes * Low voiding for superior joint integrity * Wide process window for versatile application * Compatible with enclosed print heads
Specifications: * Alloy Composition: Sn42/Bi57.6/Ag0.4 * Flux Type: Synthetic No Clean * Melting Temperature: 138°C * Weight: 50g
This solder paste is perfect for applications requiring precision and minimal thermal impact, such as in PCB assembly and repair work.
- 0-2个工作日内发货
- 配送至 美国：3-5 个工作日*
- 免费配送
- For soldering delicate electronic components.
- PCB assembly and repair.
- Material: Lead-Free Alloy
- Flux Type: No Clean
- Melting Temperature: 138°C
- Net Weight: 50g
Always follow local regulations and product guidance.
英国本土订单免标准运费。结账时可选快递配送及国际运输服务。
我们为多数产品提供30天退款保证。若商品存在质量问题，请在14天内联系我们进行更换或退款。
查看完整的配送与退货政策安全交易
我们极其重视您的支付和个人信息安全。我们的网站采用先进的加密技术，包括安全套接字层（SSL），以在传输过程中保护您的信息。您可以通过查看浏览器中的“https”和锁形图标来验证连接的安全性。
Cookie政策
Cookie通过跟踪您的购物篮并在您返回时记住您来提升购物体验。我们还根据您的浏览历史使用横幅广告，展示您可能感兴趣的产品。
安全警告
谨防网络钓鱼诈骗！我们绝不会通过电子邮件索取个人信息。如需此类信息，我们将要求您通过电话与我们联系。如收到要求提供敏感信息的电子邮件，请勿回复并立即告知我们。
相似产品
你可能也喜欢
