CHIP QUIK Lead-Free Solder Paste Syringe, No-Clean, 35g

The CHIP QUIK Lead-Free Solder Paste Syringe provides a no-clean, lead-free solution for professional soldering applications. This solder paste comes in a convenient syringe applicator with a plunger and tip, ensuring easy and precise application.

Key Benefits:

• Printing speeds up to 100mm/sec for efficient workflows.
• Long stencil life enhances durability and cost-effectiveness.
• Wide process window allows for versatile use across different applications.
• Clear residue ensures minimal cleaning requirements.
• Low voiding improves solder joint reliability.
• Excellent wetting compatibility on most board finishes for consistent performance.
• Dispense-grade formula suitable for precise dispensing.

Technical Features:

• Compatible with enclosed print heads.
• Passes BONO test at 1.56%, ensuring high-quality solder joints.
• Shelf life: >6 months when refrigerated, >2 months when unrefrigerated.
• Flux Type: Synthetic No Clean, reducing post-solder cleaning needs.
• Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu for reliable bonding performance.
• Melting Temperature: 220°C for stable soldering in various conditions.

Ideal for electronics assembly, prototyping, and rework, this solder paste is a dependable choice for professionals requiring high-quality, no-residue soldering solutions.