CHIP QUIK Lead-Free Solder Paste Syringe, No-Clean, 35g
Discover the CHIP QUIK Lead-Free Solder Paste Syringe, designed with a no-clean formula for precision and reliability in electronics assembly and rework. 50g weight.
The CHIP QUIK Lead-Free Solder Paste Syringe provides a no-clean, lead-free solution for professional soldering applications. This solder paste comes in a convenient syringe applicator with a plunger and tip, ensuring easy and precise application.
Key Benefits:
- Printing speeds up to 100mm/sec for efficient workflows.
- Long stencil life enhances durability and cost-effectiveness.
- Wide process window allows for versatile use across different applications.
- Clear residue ensures minimal cleaning requirements.
- Low voiding improves solder joint reliability.
- Excellent wetting compatibility on most board finishes for consistent performance.
- Dispense-grade formula suitable for precise dispensing.
Technical Features:
- Compatible with enclosed print heads.
- Passes BONO test at 1.56%, ensuring high-quality solder joints.
- Shelf life: >6 months when refrigerated, >2 months when unrefrigerated.
- Flux Type: Synthetic No Clean, reducing post-solder cleaning needs.
- Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu for reliable bonding performance.
- Melting Temperature: 220°C for stable soldering in various conditions.
Ideal for electronics assembly, prototyping, and rework, this solder paste is a dependable choice for professionals requiring high-quality, no-residue soldering solutions.
- Material: Lead-Free
- Weight: 50g
- Color: Silver
- Compatibility: Enclosed Print Heads
- Flux Type: Synthetic No Clean
- Temperature Resistance: Up to 150°C
- Packaging: Syringe with Plunger and Tip
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