CHIP QUIK No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip
Get precise soldering with CHIP QUIK No-Clean Solder Paste in syringe applicator. Professional & hobbyist use. Sn96.5/Ag3/Cu0.5 alloy. 50g.
The CHIP QUIK No-Clean Lead-Free Solder Paste Syringe offers a convenient and efficient solution for precision soldering applications. This solder paste comes in a ready-to-use syringe applicator, complete with a plunger and tip for easy dispensing. The no-clean formula ensures minimal residue, making it ideal for applications where post-soldering cleaning is not desired.
Key Features
- Printing speeds of up to 100mm/sec for high throughput applications.
- Long stencil life ensures durability and cost-effectiveness.
- Wide process window allows flexibility in various soldering conditions.
- Clear residue minimises post-soldering cleaning requirements.
- Low voiding provides reliable and strong solder joints.
- Excellent wetting compatibility with most board finishes ensures consistent performance.
- Dispense grade formulation for precision application.
- Compatible with enclosed print heads for enhanced usability.
- Passes BONO test @ 1.56%, ensuring high-quality standards.
Technical Specifications
- Alloy: Sn96.5/Ag3/Cu0.5
- Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
- Flux Type: No Clean
- Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 217°C
This solder paste is perfect for both professional and hobbyist applications, offering reliability and ease of use in electronic assembly and repair.
- Weight: 50 grams?
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