CHIP QUIK No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip

The CHIP QUIK No-Clean Lead-Free Solder Paste Syringe offers a convenient and efficient solution for precision soldering applications. This solder paste comes in a ready-to-use syringe applicator, complete with a plunger and tip for easy dispensing. The no-clean formula ensures minimal residue, making it ideal for applications where post-soldering cleaning is not desired.

Key Features

• Printing speeds of up to 100mm/sec for high throughput applications.
• Long stencil life ensures durability and cost-effectiveness.
• Wide process window allows flexibility in various soldering conditions.
• Clear residue minimises post-soldering cleaning requirements.
• Low voiding provides reliable and strong solder joints.
• Excellent wetting compatibility with most board finishes ensures consistent performance.
• Dispense grade formulation for precision application.
• Compatible with enclosed print heads for enhanced usability.
• Passes BONO test @ 1.56%, ensuring high-quality standards.

Technical Specifications

• Alloy: Sn96.5/Ag3/Cu0.5
• Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
• Flux Type: No Clean
• Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
• Melting Temperature: 217°C

This solder paste is perfect for both professional and hobbyist applications, offering reliability and ease of use in electronic assembly and repair.