QUALITEK Lead-Free Solder Paste, SnAgCu, 250g Pot
QUALITEK Lead-Free Solder Paste Sn/Ag/Cu alloy (95.5/3/0.5) for SMT applications. No-clean flux, non-corrosive residues. 250g pot.
The QUALITEK Lead-Free Solder Paste is a high-performance solder paste designed for surface-mount technology (SMT) applications. Formulated with a 95.5/3/0.5 Sn/Ag/Cu alloy, it provides excellent soldering performance while complying with lead-free regulations. This paste ensures a broad process window for ease of use, whether for manual or automated assembly.
The no-clean flux formulation leaves behind transparent, non-corrosive, and non-conductive residues, eliminating the need for post-soldering cleaning. Housed in a convenient 250g pot, this solder paste is ideal for SMT printing and is compatible with Type 3 MESH.
With a melting temperature range of 217°C-219°C, it delivers reliable bonding for electronic components. Perfect for professional and hobbyist applications, this solder paste combines quality, efficiency, and environmental compliance.
Key Features:
* Lead-free composition (95.5% Sn, 3% Ag, 0.5% Cu) * No-clean flux – residue-free soldering * Broad soldering process window * Type 3 MESH compatibility * Transparent, non-corrosive post-soldering residues * Melting temperature: 217°C-219°C * Packaged in a 250g pot
- SMT (Surface Mount Technology) applications
- Manual Assembly
- Automated Assembly
- Professional Electronics
- Lead-Free: Yes
- Alloy: SnAgCu (95.5/3/0.5 Tin/Silver/Copper)
- No Clean Flux
- Non Corrosive Residue
- Non Conductive Residue
- Type 3 Mesh Compatible
- Melting Temperature: 217°C-219°C
- Weight Net: 250g
- Weight Gross: 290g
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