POWER INTEGRATIONS TOP224YN PWM Switch TO220-3 75W
From £4.62
POWER INTEGRATIONS TOP224YN PWM Switch TO220-3 75W
Power Integrations
POWER INTEGRATIONS TOP224YN 75W offline PWM switch in TO-220 package. Integrates MOSFET & control for efficient flyback, forward, boost, or buck power supplies.
From £4.62
Microchip Linear Thermistor IC TO-92 10mV/°C
From £0.92
Microchip Linear Thermistor IC TO-92 10mV/°C
Microchip
Microchip linear active thermistor IC in a TO-92 package. Converts temperature to analogue voltage with 10mV/°C coefficient. Ideal for PCB layouts.
From £0.92
STMicroelectronics +5.0V Voltage Regulator 78M05 TO-220-3
From £0.85
STMicroelectronics +5.0V Voltage Regulator 78M05 TO-220-3
St MicroElectronics
STMicroelectronics 78M05 fixed +5V voltage regulator in 3-pin TO-220 package. Delivers up to 0.5A with thermal & short circuit protection.
From £0.85
NXP NPN Transistor, SOT-23, 45V 500mA
From £0.47
NXP NPN Transistor, SOT-23, 45V 500mA
NXP
NXP NPN transistor in SOT-23 case. Features 45V max collector emitter voltage, 500mA continuous current, and 100hFE min DC current gain.
From £0.47
T GLOBAL Thermal Adhesive Tape Sheet 150mm x 150mm
From £11.69
T GLOBAL Thermal Adhesive Tape Sheet 150mm x 150mm
T Global
Double-sided thermal adhesive sheet (0.95 W/m·K) for bonding gap fillers. Highly compressible, 150mm x 150mm size. Ideal for electronics cooling.
From £11.69
T GLOBAL Thermal Gap Filler Pad, 150mm Square
From £21.44
T GLOBAL Thermal Gap Filler Pad, 150mm Square
T Global
T GLOBAL thermal gap filler pad (150mm sq). Soft, compressible carbon material for heat dissipation & vibration absorption in electronics.
From £21.44
BERGQUIST Gap Pad, Non-Soft 0.06”, 100mm x 100mm Sheet
From £10.83
BERGQUIST Gap Pad, Non-Soft 0.06”, 100mm x 100mm Sheet
Bergquist
BERGQUIST non-soft thermal gap pad (0.06”, 100x100mm). Adhesive-backed sheet for heat sinks, reduces resistance & dampens vibration.
From £10.83
BOYD BGA Heat Sink with Thermal Pad - 27 x 27
From £3.26
BOYD BGA Heat Sink with Thermal Pad - 27 x 27
Boyd
Space-saving BOYD aluminium BGA heat sink with peel-and-stick pad. Features pin-fin array for efficient cooling, no mounting holes needed.